Steam‑oven control boards work in harsh conditions with high temperature, steam and oil fume. A small number of components such as capacitors, relays and optocouplers have early‑stage failure risks caused by manufacturing deviation, poor soldering and material defects. If these hidden defects are not exposed before delivery, abnormal shutdown, function disorder and protection mis‑triggering will easily occur after short‑term on‑site operation. Formulating a standardized finished‑product aging test specification for steam‑oven control boards can activate potential defects, eliminate early‑failure hidden troubles, and improve the long‑term operation reliability of control boards in actual machine. The main failure modes exposed by aging test include intermittent poor solder joints, unstable relay contact, capacitance parameter drift, partial component thermal‑induced failure, and peripheral circuit interference susceptibility. Conventional simple power‑on inspection cannot identify these latent problems. Only by simulating the actual working temperature, load switching and power fluctuation of steam oven can the early weak links of the control board be excited to fail in advance. The aging specification covers pre‑aging inspection, aging environment setting, load matching, operation logic, test cycle, fault judgment and post‑aging re‑inspection. Pre‑aging visual and electrical inspection shall be carried out before formal aging. Check PCB appearance for soldering defects such as cold joint, tin bead and virtual welding; confirm that component polarity and installation height meet requirements. Complete open‑circuit and short‑circuit detection for power supply loop, relay output loop and sampling circuit. The boards with obvious appearance or electrical faults shall be screened out in advance and shall not enter the aging station, so as to avoid interfering with aging data and damaging aging test equipment. The communication interfaces, key circuits and temperature sampling circuits shall be connected according to real machine application conditions. Aging environment and temperature setting shall simulate the thermal stress of steam oven cabinet. The aging chamber controls the ambient temperature, and carries out temperature cycling test within a certain range to simulate the heat accumulation inside the control box during steam‑oven continuous operation. Avoid single low‑temperature static power‑on, which cannot effectively activate component early defects. Meanwhile, control environmental humidity appropriately to reproduce the damp heat stress in real‑world scenarios. Place the control boards with spacing reserved, prevent stacked placement from causing heat accumulation deviation, and ensure each board obtains consistent aging stress conditions. Load simulation matching is a critical part of aging test. Pure no‑load power‑on aging cannot simulate the impact of frequent switching of heating tubes, steam generators and fans in steam oven. Connect equivalent resistance loads to relay output terminals to simulate heating load. Periodically switch on‑off the load according to real working logic, so that the relay contacts bear cyclic current impact. The NTC sampling circuit, touch key input, communication circuit and indicator light shall keep working state during aging. Power supply input shall introduce periodic voltage fluctuation to simulate the voltage surge caused by the on‑off of high‑power heating elements on‑site. Aging operation cycle and logic control. Adopt cyclic working mode of power‑on operation‑power‑off cooling, rather than continuous non‑stop power‑on. The control board automatically executes simulated steam‑oven working program, including heating output, temperature sampling, key simulation, status display and protection logic triggering. The test system real‑time monitors power consumption, output state, sampling data and communication feedback of each control board. Abnormal phenomena such as no‑start, output loss, sampling drift, display disorder and communication interruption shall be automatically recorded. Set reasonable aging duration; too short time cannot excite early defects, while excessive aging will cause unnecessary damage to qualified components. Classification judgment of aging failure. Boards with hard faults such as no power output and complete function loss are directly judged as failure. For intermittent hidden troubles such as occasional sampling drift, sporadic communication error and relay intermittent disconnection, they are also regarded as aging failure products, which need to be returned for fault analysis. Distinguish failure causes: soldering process problem, component individual defect, PCB design defect or unreasonable parameter setting. Statistical analysis of aging failure rate guides the optimization of previous SMT and component incoming inspection. Post‑aging re‑inspection and handling process. After aging cycle is completed, cool down the control boards to room temperature naturally, do not take high‑temperature boards for direct testing. Conduct full‑function re‑inspection: power‑on test each function channel, verify temperature sampling accuracy, relay on‑off action, touch response, indicator display and protection function. All electrical parameters shall return to normal range. The qualified products after re‑inspection can flow into assembly process. The failed boards shall be isolated for maintenance and root‑cause analysis, and repaired boards shall be re‑aged as required instead of directly being released. Batch management and specification iteration. Record aging environment parameters, load conditions, cycle time, failure quantity and failure phenomenon for each batch. When key components are replaced, PCB is revised or SMT process is adjusted, the aging test specification shall be verified adaptively. Keep test records traceable for quality retrospective. Strictly prohibit simplifying aging items, cancel load simulation or shorten aging cycle in mass production, otherwise early‑stage component hidden troubles cannot be effectively exposed. Through pre‑aging screening, thermal‑humidity environment simulation, real‑machine equivalent load, cyclic operation monitoring and post‑aging re‑inspection, the finished‑product aging test specification effectively excites potential early‑stage failures of steam‑oven control‑board components and solder joints, reduces the after‑sales failure rate caused by early defects, and enhances the operational reliability of control boards under high‑temperature steam kitchen‑appliance conditions.